? semiconductor components industries, llc, 2011 january, 2011 ? rev. 5 1 publication order number: mjd148/d mjd148 npn silicon power transistor dpak for surface mount applications designed for general purpose amplifier and low speed switching applications. features ? high gain ? 50 min @ i c = 2.0 a ? low saturation voltage ? 0.5 v @ i c = 2.0 a ? high current gain ? bandwidth product ? f t = 3.0 mhz min @ i c = 250 madc ? epoxy meets ul 94 v ? 0 @ 0.125 in ? esd ratings: human body model, 3b; >8000 v machine model, c; >400 v ? this is a pb ? free package ??????????????????? ??????????????????? maximum ratings ???????????? ???????????? ??? ??? ????? ????? ?? ?? ???????????? ???????????? collector ? emitter voltage ??? ??? ????? ????? ?? ?? ???????????? ???????????? ? base voltage ??? ??? ????? ????? ?? ?? ???????????? ???????????? ? base voltage ??? ??? ????? ????? ?? ?? ???????????? ???????????? ???????????? ? continuous ? peak ??? ??? ??? ????? ????? ????? ?? ?? ?? ???????????? ???????????? ??? ??? ????? ????? ?? ?? ???????????? ???????????? ???????????? c derate above 25 c ??? ??? ??? ????? ????? ????? ?? ?? ?? c ???????????? ???????????? ???????????? c derate above 25 c ??? ??? ??? ????? ????? ????? ?? ?? ?? c ???????????? ???????????? ???????????? ??? ??? ??? ????? ????? ????? ? 55 to +150 ?? ?? ?? c ??????????????????? ??????????????????? thermal characteristics ???????????? ???????????? ??? ??? ????? ????? ?? ?? ???????????? ???????????? thermal resistance, junction ? to ? case ??? ??? jc ????? ????? ?? ?? c/w ???????????? ???????????? ? to ? ambient (note 1) ??? ??? ja ????? ????? ?? ?? c/w stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. these ratings are applicable when surface mounted on the minimum pad sizes recommended. power transistor 4.0 amperes 45 volts, 20 watts marking diagram a = assembly location y = year ww = work week j148 = device code g = pb ? free package device package shipping ? ordering information mjd148t4 dpak 2500/tape & reel dpak case 369c style 1 http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 1 2 3 4 ayww j148g MJD148T4G dpak (pb ? free) 2500/tape & reel
mjd148 http://onsemi.com 2 ????????????????????????????????? ????????????????????????????????? ????????????????????????????????? (t c = 25 c unless otherwise noted) ???????????? ???????????? ???????????? characteristic ???????????? ???????????? ???????????? ???? ???? ???? ??? ??? ??? ???? ???? ???? ??? ??? ??? ????????????????????????????????? ????????????????????????????????? ???????????? ???????????? collector ? emitter sustaining voltage (note 2) ???????????? ???????????? ???? ???? ??? ??? ???? ???? ? ??? ??? vdc ???????????? ???????????? ???????????? ???????????? ???????????? ???????????? ???? ???? ???? ??? ??? ??? ? ???? ???? ???? 20 ??? ??? ??? adc ???????????? ???????????? ???????????? ???????????? ???? ???? ??? ??? ? ???? ???? 1 ??? ??? ????????????????????????????????? ????????????????????????????????? on characteristics ???????????? ???????????? ???????????? ???????????? ???????????? dc current gain (note 2) ???????????? ???????????? ???????????? ???????????? ???????????? ???? ???? ???? ???? ???? ??? ??? ??? ??? ??? ???? ???? ???? ???? ???? ? 375 ? ? ??? ??? ??? ??? ??? ???????????? ???????????? collector ? emitter saturation voltage (note 2) ???????????? ???????????? ???? ???? ??? ??? ? ???? ???? 0.5 ??? ??? ???????????? ???????????? ? emitter on voltage (note 2) ???????????? ???????????? ???? ???? ??? ??? ? ???? ???? 1.1 ??? ??? ????????????????????????????????? ????????????????????????????????? dynamic characteristics ???????????? ???????????? ???????????? current ? gain ? bandwidth product ???????????? ???????????? ???????????? ???? ???? ???? ??? ??? ??? ???? ???? ???? ? ??? ??? ??? mhz 2. pulse test: pulse width 300 s, duty cycle 2%.
mjd148 http://onsemi.com 3 figure 1. dc current gain i c , collector current (a) 10 0.1 0.004 3 1 0.5 0.01 0.1 0.2 0.3 0.5 1 2 3 4 5 2 0.3 0.2 0.007 0.02 0.05 0.03 t j = 150 c = 25 c v ce = 2 v v ce = 10 v ? 55 c h fe , dc current gain (normalized) typical characteristics figure 2. collector saturation region i b , base current (ma) 2 0 0.05 1.6 1.2 0.1 1 2 3 5 10 20 30 500 0.8 0.4 0.07 0.2 0.5 0.3 t j = 25 c i c = 10 ma 0.7 7 50 70 100 200 300 100 ma 1 a 3 a v ce , collector ? emitter voltage (v) 2 0.005 figure 3. ?on? voltages i c , collector current (a) 0 0.01 0.020.030.05 0.1 0.5 1 4 0.8 figure 4. temperature coefficients + 2.5 i c , collector current (a) 1.6 1.2 voltage (v) 0.4 0.20.3 2 3 t j = 25 c v be(sat) @ i c /i b = 10 v ce(sat) @ i c /i b = 10 v be @ v ce = 2 v 0.005 0.01 0.020.030.05 0.1 0.5 1 0.20.3 2 3 +2 + 1.5 +1 0 ? 0.5 ? 1 ? 1.5 ? 2 + 0.5 ? 2.5 *applies for i c /i b h fe /2 * t j = ? 65 c to + 150 c * v for v ce(sat) v for v be y , temperature coefficients (mv/ c) 4
mjd148 http://onsemi.com 4 10 3 ? 0.4 figure 5. collector cut ? off region v be , base ? emitter voltage (v) 10 1 10 ? 3 10 2 10 0 10 ? 1 10 ? 2 ? 0.3 ? 0.2 ? 0.1 0 + 0.1 + 0.2 + 0.3 + 0.4 + 0.5 + 0.6 reverse forward t j = 150 c v ce = 30 v 100 c 25 c i ces figure 6. thermal response t, time (ms) 1 0.01 0.01 0.5 0.2 0.1 0.05 0.02 0.05 1 2 5 10 20 50 100 200 1 k 500 z jc(t) = r(t) r qjc r qjc = 6.25 c/w max d curves apply for power pulse train shown read time at t 1 t j(pk) ? t c = p (pk) z qjc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 d = 0.5 0.2 0.05 0.01 single pulse 0.1 0.7 0.3 0.07 0.03 0.02 0.1 0.5 0.2 i c , collector current (ma) r(t), transient thermal resistance (normalized) 10 1 figure 7. maximum rated forward bias v ce , collector ? emitter voltage (v) 5 3 2 0.5 0.01 510 bonding wire limit thermal limit second breakdown limit i c , collector current (a) dc 500 s 0.3 0.05 23 1ms 20 30 50 70 1 0.2 7 0.1 0.03 0.02 t c = 25 c single pulse, d 0.1% t j = 150 c 5ms forward bias safe operating area information there are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. safe operating area curves indicate i c ? v ce limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. the data of figure 7 is based on t j(pk) = 150 c; t c is variable depending on conditions. second breakdown pulse limits are valid for duty cycles to 10% provided t j(pk) 150 c. t j(pk) may be calculated from the data in figure 6. at high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
mjd148 http://onsemi.com 5 package dimensions dpak (single gauge) case 369c ? 01 issue d style 1: pin 1. base 2. collector 3. emitter 4. collector b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw 5.80 0.228 2.58 0.101 1.6 0.063 6.20 0.244 3.0 0.118 6.172 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. mjd148/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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